In electronics manufacturing, high-purity solvents are used for cleaning, etching, and chemical reactions. FUNDAMIX® mixers provide uniform dispersion and blending of solvent mixtures while avoiding shear forces and vortex formation that could introduce contamination. The system’s enclosed, hygienic design supports safe handling of volatile or hazardous solvents and maintains strict purity standards required for advanced electronic components.
The controlled dissolution of copper using sulfuric acid at elevated temperatures is a critical step in PCB production and copper foil manufacturing. FUNDAMIX® offers consistent and reliable agitation, ensuring homogeneous heat distribution and effective contact between solid copper and acid. Its non-rotating design minimizes wear and maintenance in aggressive chemical environments, while temperature-resistant construction ensures durability under demanding thermal and corrosive conditions.
In the production of electronic displays and lighting components, plasma-enhanced chemical vapor deposition (CVD) is used to coat substrates with fluorescent powders. FUNDAMIX® supports this process by uniformly mixing fine powders in fluidized beds, maintaining even distribution and preventing agglomeration. Its vibration-based motion allows for gentle yet effective mixing of delicate phosphors and other functional powders, helping ensure coating quality and material efficiency.
Lithium-ion battery performance is heavily influenced by the consistency and homogeneity of electrode slurries. FUNDAMIX® delivers precise mixing of anode materials such as graphite or silicon-carbon blends with binders and conductive additives, ensuring a uniform distribution without introducing shear-induced degradation. Its vibration-driven system maintains slurry quality over extended cycles and supports reproducibility across production batches.
LED manufacturing involves multiple liquid processing stages where mixing uniformity directly impacts final product quality and yield. FUNDAMIX® ensures thorough homogenization of photoluminescent materials, resins, and encapsulants, while minimizing bubble formation and protecting sensitive compounds. Its sealed, CIP-ready construction is well-suited for the high cleanliness standards required in LED and optoelectronic production environments.
